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Change core facility
Facility2
History
Name:
The name of this core facility.
Core facility tools:
3D Printer
3D Printer 2
A101 Busch & Lomb
A101 Leica MZ7
A102 Develop Hood
A102 Nikon MM-800
A102 Spinner Hood
A102 Spinner Left
A102 Spinner Right
A103 Develop Hood
A103 Nikon L200
A103 Photomask Bench
A103 Spinner Hood
A103 Spinner Left
A103 Spinner Right
A104 EBL Develop Hood Left
A104 EBL Develop Hood Right
A104 EBL Spinner Hood
A104 EBL Spinner Left
A104 EBL Spinner Right
A105 Develop Hood
A105 Nikon L200
A105 Solvent Hood
A106 Base Hood
ASML Design Station
ASML Stepper
Aluminum Wire Bonder
AnnealSys RTA
Asylum AFM
Atomic Layer Deposition
B101 Acid Hood
B101 Hot Phos Bench
B101 KOH Bench
B101 RCA Bench
B101 Solvent Hood
B101 Spin Rinse Dryer
B102 Acid Hood
B102 Furnace RCA Clean
B102 Solvent Hood
B102 Spin Rinse Dryer
B104 Solvent Hood
B107 Nikon L200
B107 Nikon SMZ1500
Bruker AFM
CMP
Critical Point Dryer 1
Critical Point Dryer 2
DUV Resist Stabilizer
Dektak XT 1
Dektak XT 2
Dicing saw
Downstream Asher
Dynatex GSX Scribe and Break
E-Beam Evaporator
E-Beam and Thermal Evaporator
Ellipsometer
FEI FIB 1
FEI FIB 2
Film Stress
Filmetrics F40-UV
Filmetrics F50-UV Mapping
Flip Chip Bonder
Four Dimensions 4pt Probe
Gemini 500 FESEM
Glow Discharge
Gold Wire Bonder
Goniometer
HMDS Prime
Hall Effect Measurement
Hotplate 1
Hotplate 2
Ion Mill
JEOL E-beam
JEOL E-beam Cleanroom
Jandel 4pt Probe
LHL Tube 1 Oxide
LHL Tube 2 Anneal
LHL Tube 3 Nitride
LHL Tube 4 LTO
Laser Mask Writer
Leica EM GP
MLA 150
Mercury Probe
Metal Liftoff
Microfluidic Test Station
Microwave Asher
Nano Enclosure
Nano-imprinter
NanoMill
NanoSpec
Nitrogen Oven
Oxford III-V Etcher
Oxford Metal Etcher
Oxford Silicon Etcher
PDMS Curing Oven 1
PDMS Curing Oven 2
PDMS Mixer
PDMS Plasma Bonder
PDMS Puncher
PDMS Spin Coater
PECVD
Parametric Test
Parylene Deposition
RHL Tube 1 Oxide
RHL Tube 2 Anneal
RHL Tube 3 Nitride
RHL Tube 4 Poly
SPTS Deep Si Etch
SPTS HF Vapor Etcher
SSEC Piranha 1
SSEC Piranha 2
SSEC RCA
Sensofar Optical Profilometer
Silanization Oven
Sinter
Sputter B104 Left
Sputter B104 Right
Suss Resist Coater
Suss Resist Developer
SussMA6
SussMA8
TITAN TEM
Thermal Thin-Al Evaporator
Unaxis Deep Si Etcher
Unaxis ICP Etcher
Vac Oven 1
Vac Oven 2
Vac Oven 3
Veeco AFM
Wafer Bonder
Wafer Cleaner
Wyatt DLS
XRD
XeF2 Silicon Etcher
ZEISS FESEM
Core facility areas:
Campus
CPM Lab
Core facility consumables:
2 inch wafer tray
Cleanroom gown
Storage bin
Tweezers
Delete