• Personal schedule
• All tools

Clear Selection

Areas

• Campus
  • Cleanroom
  • CPM Lab

Tools

• Chemical Vapor Deposition
  • Atomic Layer Deposition
  • PECVD
• Dry Etch
  • 790 RIE Middle
  • 790 RIE Nitride Left
  • 790 RIE Right
  • Downstream Asher
  • Ion Mill
  • Microwave Asher
  • Oxford III-V Etcher
  • Oxford Metal Etcher
  • Oxford Silicon Etcher
  • SPTS Deep Si Etch
  • Unaxis Deep Si Etcher
  • Unaxis ICP Etcher
  • XeF2 Silicon Etcher
• Engineering
  • Additive Manufacturing
    • 3D Printer
• Focused Ion Beams
  • FEI FIB 1
  • FEI FIB 2
• Furnaces
  • AnnealSys RTA
  • B102 Furnace RCA Clean
  • LHL Tube 1 Oxide
  • LHL Tube 2 Anneal
  • LHL Tube 3 Nitride
  • LHL Tube 4 LTO
  • RHL Tube 1 Oxide
  • RHL Tube 2 Anneal
  • RHL Tube 3 Nitride
  • RHL Tube 4 Poly
• Gen Furnaces
  • Sinter
• Imaging and Analysis
  • Asylum AFM
  • Bruker AFM
  • Gemini 500 FESEM
  • Glow Discharge
  • Leica EM GP
  • NanoMill
  • TITAN TEM
  • Veeco AFM
  • ZEISS FESEM
• Lithography
  • ASML Design Station
  • ASML Stepper
  • DUV Resist Stabilizer
  • HMDS Prime
  • Hotplate 1
  • Hotplate 2
  • JEOL E-beam
  • JEOL E-beam Cleanroom
  • Laser Mask Writer
  • MLA 150
  • Nano-imprinter
  • Nitrogen Oven
  • Suss Resist Coater
  • Suss Resist Developer
  • SussMA6
  • SussMA8
  • Vac Oven 1
  • Vac Oven 2
  • Vac Oven 3
  • Spin-Develop
    • A102 Develop Hood
    • A102 Spinner Hood
    • A102 Spinner Left
    • A102 Spinner Right
    • A103 Develop Hood
    • A103 Photomask Bench
    • A103 Spinner Hood
    • A103 Spinner Left
    • A103 Spinner Right
    • A104 EBL Develop Hood Left
    • A104 EBL Develop Hood Right
    • A104 EBL Spinner Hood
    • A104 EBL Spinner Left
    • A104 EBL Spinner Right
    • A105 Develop Hood
    • A105 Solvent Hood
• Metrology
  • Dektak XT 1
  • Dektak XT 2
  • Ellipsometer
  • Film Stress
  • Filmetrics F40-UV
  • Filmetrics F50-UV Mapping
  • Four Dimensions 4pt Probe
  • Goniometer
  • Hall Effect Measurement
  • Jandel 4pt Probe
  • Mercury Probe
  • NanoSpec
  • Parametric Test
  • Sensofar Optical Profilometer
  • Wyatt DLS
  • XRD
• Optical Microscopes
  • A101 Busch & Lomb
  • A101 Leica MZ7
  • A102 Nikon MM-800
  • A103 Nikon L200
  • A105 Nikon L200
  • B107 Nikon L200
  • B107 Nikon SMZ1500
• Packaging
  • Aluminum Wire Bonder
  • Dicing saw
  • Dynatex GSX Scribe and Break
  • Flip Chip Bonder
  • Gold Wire Bonder
• Physical Vapor Deposition
  • 4Wave Cluster Sputter
  • E-Beam Evaporator
  • E-Beam and Thermal Evaporator
  • Parylene Deposition
  • Sputter B104 Left
  • Sputter B104 Right
  • Thermal Thin-Al Evaporator
• Soft Lithography
  • Microfluidic Test Station
  • PDMS Curing Oven 1
  • PDMS Curing Oven 2
  • PDMS Mixer
  • PDMS Plasma Bonder
  • PDMS Puncher
  • PDMS Spin Coater
  • Silanization Oven
• Specialty Tools
  • CMP
  • Critical Point Dryer 1
  • Critical Point Dryer 2
  • Nano Enclosure
  • Wafer Bonder
  • Wafer Cleaner
• Wet Chemistry
  • A106 Base Hood
  • B101 Acid Hood
  • B101 Hot Phos Bench
  • B101 KOH Bench
  • B101 RCA Bench
  • B101 Solvent Hood
  • B101 Spin Rinse Dryer
  • B102 Acid Hood
  • B102 Solvent Hood
  • B102 Spin Rinse Dryer
  • B104 Solvent Hood
  • Metal Liftoff
  • SPTS HF Vapor Etcher
  • SSEC Piranha 1
  • SSEC Piranha 2
  • SSEC RCA