Basic Information
- First name: Captain
- Last name: Nemo
- Username: captain
- Email: captain.nemo@nautilus.com
- Type: Lab staff
- Date joined: Monday, December 10th, 2012 @ 11:43 AM
- Last login: Wednesday, November 5th, 2025 @ 7:45 AM
- Access expiration: Access never expires
Projects
-
Active:
- Cleanroom Eng
- Project 3
-
Inactive:
- Project 2
Tool Qualifications
- Dicing saw
- PECVD
- Sinter
Tool responsibilities
-
Primary owner:
- 4Wave Cluster Sputter
- 790 RIE Middle
- 790 RIE Nitride Left
- 790 RIE Right
- A101 Busch & Lomb
- A101 Leica MZ7
- A102 Develop Hood
- A102 Nikon MM-800
- A102 Spinner Hood
- A102 Spinner Left
- A102 Spinner Right
- A103 Develop Hood
- A103 Nikon L200
- A103 Photomask Bench
- A103 Spinner Hood
- A103 Spinner Left
- A103 Spinner Right
- A104 EBL Develop Hood Left
- A104 EBL Develop Hood Right
- A104 EBL Spinner Hood
- A104 EBL Spinner Left
- A104 EBL Spinner Right
- A105 Develop Hood
- A105 Nikon L200
- A105 Solvent Hood
- A106 Base Hood
- ASML Design Station
- ASML Stepper
- Aluminum Wire Bonder
- AnnealSys RTA
- Asylum AFM
- Atomic Layer Deposition
- B101 Acid Hood
- B101 Hot Phos Bench
- B101 KOH Bench
- B101 RCA Bench
- B101 Solvent Hood
- B101 Spin Rinse Dryer
- B102 Acid Hood
- B102 Furnace RCA Clean
- B102 Solvent Hood
- B102 Spin Rinse Dryer
- B104 Solvent Hood
- B107 Nikon L200
- B107 Nikon SMZ1500
- Bruker AFM
- CMP
- Critical Point Dryer 1
- Critical Point Dryer 2
- DUV Resist Stabilizer
- Dektak XT 1
- Dektak XT 2
- Dicing saw
- Downstream Asher
- Dynatex GSX Scribe and Break
- E-Beam Evaporator
- E-Beam and Thermal Evaporator
- Ellipsometer
- FEI FIB 1
- FEI FIB 2
- Film Stress
- Filmetrics F40-UV
- Filmetrics F50-UV Mapping
- Flip Chip Bonder
- Four Dimensions 4pt Probe
- Gemini 500 FESEM
- Glow Discharge
- Gold Wire Bonder
- Goniometer
- HMDS Prime
- Hall Effect Measurement
- Hotplate 1
- Hotplate 2
- Ion Mill
- JEOL E-beam
- JEOL E-beam Cleanroom
- Jandel 4pt Probe
- LHL Tube 1 Oxide
- LHL Tube 2 Anneal
- LHL Tube 3 Nitride
- LHL Tube 4 LTO
- Laser Mask Writer
- Leica EM GP
- MLA 150
- Mercury Probe
- Metal Liftoff
- Microfluidic Test Station
- Microwave Asher
- Nano Enclosure
- Nano-imprinter
- NanoMill
- NanoSpec
- Nitrogen Oven
- Oxford III-V Etcher
- Oxford Metal Etcher
- Oxford Silicon Etcher
- PDMS Curing Oven 1
- PDMS Curing Oven 2
- PDMS Mixer
- PDMS Plasma Bonder
- PDMS Puncher
- PDMS Spin Coater
- PECVD
- Parametric Test
- Parylene Deposition
- RHL Tube 1 Oxide
- RHL Tube 2 Anneal
- RHL Tube 3 Nitride
- RHL Tube 4 Poly
- SPTS Deep Si Etch
- SPTS HF Vapor Etcher
- SSEC Piranha 1
- SSEC Piranha 2
- SSEC RCA
- Sensofar Optical Profilometer
- Silanization Oven
- Sinter
- Sputter B104 Left
- Sputter B104 Right
- Suss Resist Coater
- Suss Resist Developer
- SussMA6
- SussMA8
- TITAN TEM
- Thermal Thin-Al Evaporator
- Unaxis Deep Si Etcher
- Unaxis ICP Etcher
- Vac Oven 1
- Vac Oven 2
- Vac Oven 3
- Veeco AFM
- Wafer Bonder
- Wafer Cleaner
- Wyatt DLS
- XRD
- XeF2 Silicon Etcher
- ZEISS FESEM
-
Backup owner:
- Dicing saw
- PECVD
- Sinter
Physical access levels
- Cleanroom access